Name: Repair Module 3: Chip-Off Forensics & Advanced PCB Repair
Price: 3500 GBP
Availability: InStock

COURSE DETAILS

Duration: 4.5 Days (Teaching Lab Based)

Level: Intermediate

Max Class Size: 8 Delegates (2 Trainers)

Certification: Reboot Repair Module 3 Certificate

Pre-requisites: Repair Modules 1 & 2 recommended; basic soldering knowledge beneficial

Equipment: All tools, equipment and practice devices provided

Location: The Electronics Group, Leeds LS16 6QE

COURSE FEE £3,500 + VAT per delegate

WHY REPAIR MODULE 3?

As mobile phones and drones become central to criminal investigations, practitioners face a growing challenge: physically damaged or inaccessible devices that conventional software tools cannot reach. Drone PCBs present unique hardware obstacles — compact, multi-layered boards with epoxy-bonded or stacked memory chips — making chip-off forensics the only viable route to evidence.

Repair Module 3 takes forensic practitioners beyond software and into the hardware realm. Built around smartphone chip-off as its primary focus, the course also applies these techniques directly to drone PCBs. Delegates master the complete workflow: safe chip removal, cleaning and preparation, solder stencilling, raw memory reading, and PCB repair — with every technique designed to withstand scrutiny in a Court of Law.

WHO WILL BENEFIT

Aimed at digital forensic practitioners encountering physically damaged mobile phones and drones where conventional extraction routes are unavailable.

•Digital forensic examiners handling physically damaged or locked mobile devices
•Military & defence practitioners recovering drone evidence
•Drone investigation specialists and UAS forensic examiners
•Repair Module 1 & 2 graduates developing advanced hardware skills

WHAT WE TEACH ON THIS COURSE

4.5 intensive days of classroom theory and hands-on lab work, progressing from chip fundamentals through to advanced PCB intervention for both mobile phones and drones:

•Memory chip architectures: NAND, eMMC, UFS — package types & identification

•Flash memory data recovery: dump files, page structures and ECC

•Non-epoxied BGA chip removal & reinstatement using hot-air rework stations

•Epoxied chip removal: chemical & thermal techniques for phones and drone PCBs

•Chip cleaning, preparation and re-balling with solder stencils

•Raw memory reading using specialist reader equipment (NAND & eMMC)

•Pad & trace repair: copper repair, trace bridging and pad rebuilding

•Stacked PCB handling (PoP): layer separation, reading & reassembly

THE REPAIR MODULE SERIES

MODULE 1 · FOUNDATION

Repair Module 1

Core repair skills and essential techniques for common mobile devices. Hands-on practical tuition in battery, screen and data port repair and replacement.

MODULE 2 · INTERMEDIATE

Repair Module 2

Advanced board-level diagnosis, micro-soldering introduction and complex fault-finding across a wider range of device models.

MODULE 3 · INTERMEDIATE

Repair Module 3

Expert-level micro-soldering, NAND and chip-level repair techniques for maximum data recovery potential.

YOU ARE HERE

PRE-COURSE REQUIREMENTS

Completion of Repair Modules 1 and 2 is strongly recommended, as this module builds directly on the board-level diagnostics and component handling skills from those programmes. Basic soldering experience is highly beneficial for those attending this course.